Small flow rates up to 1mL/shot provide greater accuracy for chemical condensation control required during wafer cleaning. The CFD series provides accurate flow rates to prevent excess addition or liquid waste. In addition, the anti-siphon design prevents accidental inhalation.

Corrosion-resistant overcurrent end

PTFE/PFA/PCTFE is capable of handling strong acid, strong base and hydrogen peroxide used in semiconductor processing. PTFE/PFA/PP/PVC external parts and PTFE coated screws provide additional protection against chemical corrosion.

Wide spit rate adjustment

Open the bottom cover to easily adjust the stroke length between 1.0-2.7ml/shot (factory default is 1.0ml/shot).